2016 12th International Congress Molded Interconnect Devices (MID) /

Annotation Due to a direct application of conductor tracks and functional structures on randomly shaped substrates, the technology MID (Molded Interconnect Devices Mechatronic Integrated Devices) enables the production of highly integrated mechatronic products. Since 1994, the Research Association 3...

Ausführliche Beschreibung

Gespeichert in:
Weitere Titel:
2016 12th International Congress Molded Interconnect Devices
Körperschaft:
Institute of Electrical and Electronics Engineers
Format:
Elektronisch E-Book
Sprache:
Englisch
Veröffentlicht:
Piscataway, NJ : IEEE, 2016.
Zusammenfassung:
Annotation Due to a direct application of conductor tracks and functional structures on randomly shaped substrates, the technology MID (Molded Interconnect Devices Mechatronic Integrated Devices) enables the production of highly integrated mechatronic products. Since 1994, the Research Association 3 D MID biennially organizes the International Congress Molded Interconnect Devices in Germany in order to support the further development of the technology by offering a platform for the global transfer of knowledge and information. With about 300 participants from all over the world this international recognized conference is the worlds leading event in the field of MID Further information http://www.3dmid.de/technology.html.
Umfang:
1 online resource (various pagings) : illustrations
ISBN:
1-5090-5428-6
Schlagworte:
Three-dimensional display systems > Congresses.
Molded interconnect devices > Congresses.
Bezugswerke:
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