2016 International Conference on Electronics Packaging (ICEP) : 20-22 April 2016, Hokkaido, Japan /

ICEP is the international conference covering wide ranges of electronics packaging technologies, such as advanced packaging, new materials, fabrication process, modeling simulation, and applications.

Gespeichert in:
Weitere Titel:
2016 International Conference on Electronics Packaging
Körperschaft:
Institute of Electrical and Electronics Engineers
Format:
Elektronisch E-Book
Sprache:
Englisch
Veröffentlicht:
Piscataway, New Jersey : IEEE, [2016]
Zusammenfassung:
ICEP is the international conference covering wide ranges of electronics packaging technologies, such as advanced packaging, new materials, fabrication process, modeling simulation, and applications.
Umfang:
1 online resource (692 pages) : illustrations
ISBN:
4-904090-17-9
Schlagworte:
Electronic packaging > Congresses.
Bezugswerke:
Links: