2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) : proceedings : October 21 (Wed) - 23 (Fri), 2015, Taipei Nangang Exhibition Center /

The IMPACT Conference is the largest gathering of packaging and PCB professionals in Taiwan.

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Weitere Titel:
2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference
Microsystems, Packaging, Assembly and Circuits Technology Conference
Körperschaft:
International Microsystems, Packaging, Assembly, and Circuits Technology Conference
Format:
Tagungsbericht Elektronisch E-Book
Sprache:
Englisch
Veröffentlicht:
Piscataway, NJ : IEEE, 2015.
Zusammenfassung:
The IMPACT Conference is the largest gathering of packaging and PCB professionals in Taiwan.
Umfang:
1 online resource (398 pages) : illustrations
Anmerkungen:
Includes index.
ISBN:
1-4673-8356-2
1-4673-8357-0
Schlagworte:
Microelectronic packaging > Congresses.
Microelectromechanical systems > Congresses.
Microelectronics > Congresses.
Bezugswerke:
Links: