2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium : 16-18 December 2018, Chandigarh, India /

Gespeichert in:
Körperschaften:
IEEE Electrical Design of Advanced Packaging and Systems Symposium Chandigarh, India, Institute of Electrical and Electronics Engineers (sponsoring body.)
Format:
Tagungsbericht Elektronisch E-Book
Sprache:
Englisch
Veröffentlicht:
Piscataway, New Jersey : Institute of Electrical and Electronics Engineers, 2018.
Umfang:
1 online resource (54 pages)
ISBN:
1-5386-6592-1
Schlagworte:
Electronic packaging > Design and construction > Congresses.
Electronic systems > Design and construction > Congresses.
Bezugswerke:
Links: