2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) /

This workshop will focus on low temperature bonding technologies which will ultimately lead to entirely new manufacturing approaches to 3D and heterogeneous integration of semiconductor devices and microsystems, as well as photonic systems The workshop invites papers that document new developments i...

Ausführliche Beschreibung

Gespeichert in:
Weitere Titel:
2017 5th International Workshop on Low Temperature Bonding for 3D Integration
Körperschaft:
Institute of Electrical and Electronics Engineers
Format:
Elektronisch E-Book
Sprache:
Englisch
Veröffentlicht:
Piscataway, New Jersey : IEEE, 2017.
Zusammenfassung:
This workshop will focus on low temperature bonding technologies which will ultimately lead to entirely new manufacturing approaches to 3D and heterogeneous integration of semiconductor devices and microsystems, as well as photonic systems The workshop invites papers that document new developments in low temperature bonding technologies, new device applications, facilities and technologies for mass production, and basic science relating to these technologies Their impact on the paradigm shift in the semiconductor industry along with 3D integration technologies is also of interest.
Umfang:
1 online resource : illustrations
ISBN:
4-904743-03-2
Schlagworte:
Sealing (Technology) > Congresses.
Three-dimensional integrated circuits > Congresses.
Bezugswerke:
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