2017 IEEE 21st Workshop on Signal and Power Integrity (SPI) /

Characterization, modeling and design for signal and power integrity of electronic systems Modeling, simulation and measurement of electrical interconnect performance at chip, board and package levels Innovative CAD concepts and algorithms Applications to computing devices, mobile devices, automotiv...

Ausführliche Beschreibung

Gespeichert in:
Weitere Titel:
2017 IEEE 21st Workshop on Signal and Power Integrity
Körperschaft:
Institute of Electrical and Electronics Engineers
Format:
Elektronisch E-Book
Sprache:
Englisch
Veröffentlicht:
Piscataway, New Jersey : IEEE, 2017.
Zusammenfassung:
Characterization, modeling and design for signal and power integrity of electronic systems Modeling, simulation and measurement of electrical interconnect performance at chip, board and package levels Innovative CAD concepts and algorithms Applications to computing devices, mobile devices, automotive aerospace.
Umfang:
1 online resource (188 pages) : illustrations
ISBN:
1-5090-5616-5
Schlagworte:
Signal integrity (Electronics) > Congresses.
Bezugswerke:
Links: