2017 ACM/IEEE International Workshop on System Level Interconnect Prediction (SLIP) /

High speed chip to chip interconnect design Design and analysis of chip package interfaces Power consumption of interconnects 3D interconnect design and prediction Emerging interconnect technologies Applications of interconnects to social, genetic, and biological systems Co optimization of interconn...

Ausführliche Beschreibung

Gespeichert in:
Weitere Titel:
2017 ACM/IEEE International Workshop on System Level Interconnect Prediction
Hauptverfasser:
Ho, Tsung-Yi, Hu, Shiyan, Badaroglu, Mustafa
Format:
Elektronisch E-Book
Sprache:
Englisch
Veröffentlicht:
Piscataway, N.J. : IEEE, 2017.
Zusammenfassung:
High speed chip to chip interconnect design Design and analysis of chip package interfaces Power consumption of interconnects 3D interconnect design and prediction Emerging interconnect technologies Applications of interconnects to social, genetic, and biological systems Co optimization of interconnect technology and chip design High speed chip to chip interconnect design Design and analysis of chippackage interfaces Power consumption of interconnects 3D interconnect design and prediction Emerging interconnect technologies Applications of interconnects to social, genetic, and biological systems Co optimization of interconnect technology and chip design.
Umfang:
1 online resource : illustrations
ISBN:
1-5386-1536-3
Schlagworte:
Multiprocessors > Congresses.
Interconnects (Integrated circuit technology) > Congresses.
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