2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS : 12-15 May 2019, Paris, France /

Gespeichert in:
Körperschaften:
Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS Paris, France, Institute of Electrical and Electronics Engineers (sponsoring body.)
Format:
Tagungsbericht Elektronisch E-Book
Sprache:
Englisch
Veröffentlicht:
Piscataway, New Jersey : Institute of Electrical and Electronics Engineers, 2019.
Umfang:
1 online resource (63 pages)
ISBN:
1-7281-3286-X
Schlagworte:
Microelectronic packaging > Congresses.
Microelectromechanical systems > Congresses.
Micromachining > Congresses.
Bezugswerke:
Links: