2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) /

The conference brings together both academics as well as industry leaders to discuss and debate the state of the art and future trends in microelectronics components, packaging, integration and manufacturing technologies.

Gespeichert in:
Weitere Titel:
2017 IMAPS Nordic Conference on Microelectronics Packaging
Körperschaft:
Institute of Electrical and Electronics Engineers Staff
Format:
Elektronisch E-Book
Sprache:
Englisch
Veröffentlicht:
Piscataway, New Jersey : IEEE, 2017.
Zusammenfassung:
The conference brings together both academics as well as industry leaders to discuss and debate the state of the art and future trends in microelectronics components, packaging, integration and manufacturing technologies.
Umfang:
1 online resource
Anmerkungen:
In English.
ISBN:
1-5386-3055-9
Schlagworte:
Electronic packaging > Congresses.
Microelectronics > Congresses.
Bezugswerke:
Links: