2020 33rd International Conference on VLSI Design and 2020 19th International Conference on Embedded Systems (VLSID) /

Incredible demand on functionality in a chip in a given power thermal envelope forcing transistor geometries go smaller which is imposing newer challenges in VLSI design and associated EDA tools flows methodologies In 33rd International Conference of VLSI Design and 19th International Conference on...

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Weitere Titel:
2020 33rd International Conference on VLSI Design and 2020 19th International Conference on Embedded Systems
Körperschaft:
Institute of Electrical and Electronics Engineers
Format:
Elektronisch E-Book
Sprache:
Englisch
Veröffentlicht:
Piscataway, New Jersey : IEEE 2020.
IEEE,
Zusammenfassung:
Incredible demand on functionality in a chip in a given power thermal envelope forcing transistor geometries go smaller which is imposing newer challenges in VLSI design and associated EDA tools flows methodologies In 33rd International Conference of VLSI Design and 19th International Conference on Embedded Design, we plan to bring together all the leaders from industries, academia, industry bodies, government, standard organizations to go over all technology enablers in an outside in approach to design VLSI which includes intelligent systems design, new techniques in algorithms, HW SW Protocol standards, core VLSI design, EDA tools flows methodologies and core silicon technologies.
Umfang:
1 online resource
ISBN:
9781728157016
1728157013
Schlagworte:
Embedded computer systems > Congresses.
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