2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME 2019) : 23rd - 26th of October 2019, Cluj-Napoca, Romania /

Gespeichert in:
Weitere Titel:
2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging
Körperschaft:
Institute of Electrical and Electronics Engineers
Format:
Elektronisch E-Book
Sprache:
Englisch
Veröffentlicht:
Pistacaway, New Jersey : IEEE, [2019]
Umfang:
1 online resource (426 pages) : illustrations
Anmerkungen:
Includes index.
ISBN:
1-7281-3330-0
Schlagworte:
Electronic packaging > Design > Data processing > Congresses.
Electronic apparatus and appliances > Congresses.
Bezugswerke:
Links: