1998 2nd IEMT/IMC Symposium : April 15-17, 1998, Sonic City-Omiya, Tokyo, Japan

Gespeichert in:
Körperschaften:
IEMT/IMC Symposium (Corporate Author), IEMT/IMC Symposium Ōmiya-shi, Japan, Components, Packaging & Manufacturing Technology Society (Content Provider), International Microelectronics and Packaging Society (Content Provider)
Format:
Tagungsbericht Elektronisch E-Book
Sprache:
Englisch
Veröffentlicht:
[Place of publication not identified] IEEE 1998
Anmerkungen:
Bibliographic Level Mode of Issuance: Monograph
Anmerkungen:
English
Schlagworte:
Microelectronic packaging > Congresses > Japan.
Electronic apparatus and appliances > Design and construction > Congresses.
Microelectronics industry > Technological innovations > Congresses.
Electrical & Computer Engineering
Electrical Engineering
Engineering & Applied Sciences
Bezugswerke: