1997 47th Electronic Components and Technology Conference

The papers in this work cover many topics, including not only electronic components, but also developments in all areas of electronic technology. Emerging technologies such as optoelectronic and ballgrid array packaging are reported.

Gespeichert in:
Körperschaften:
IEEE Components, Packaging and Manufacturing Technology Society Staff (Corporate Author), Institute of Electrical and Electronics Engineers, Inc. Staff (Content Provider)
Format:
Elektronisch E-Book
Sprache:
Englisch
Veröffentlicht:
[Place of publication not identified] IEEE 1997
Zusammenfassung:
The papers in this work cover many topics, including not only electronic components, but also developments in all areas of electronic technology. Emerging technologies such as optoelectronic and ballgrid array packaging are reported.
Umfang:
1 online resource (1300 pages)
Anmerkungen:
Bibliographic Level Mode of Issuance: Monograph
Anmerkungen:
English
ISSN:
2377-5726
Schlagworte:
Electronic industries > Congresses.
Bezugswerke:
Links: