IEEE Annual International Reliability Physics, 1991

Thin film cracking in plastic IC / wire bond failure modes / electromigration phenomena / hot-carrier degradation / reliability aspects of HEMTs.

Gespeichert in:
Körperschaften:
IEEE, Electron Devices Society and Reliability Society Staff (Corporate Author), IEEE, Society Staff (Content Provider)
Format:
Elektronisch E-Book
Sprache:
Englisch
Veröffentlicht:
[Place of publication not identified] IEEE 1991
Zusammenfassung:
Thin film cracking in plastic IC / wire bond failure modes / electromigration phenomena / hot-carrier degradation / reliability aspects of HEMTs.
Umfang:
1 online resource (viii, 367 pages) : illustrations
Anmerkungen:
Bibliographic Level Mode of Issuance: Monograph
Anmerkungen:
English
Schlagworte:
Reliability (Engineering) > Congresses.
Bezugswerke: