Stein, S. (2022). Laser drop on demand joining as bonding method for electronics assembly and packaging with high thermal requirements. FAU University Press.
Chicago-Zitierstil (17. Ausg.)Stein, Stefan. Laser Drop on Demand Joining as Bonding Method for Electronics Assembly and Packaging with High Thermal Requirements. FAU University Press, 2022.
MLA-Zitierstil (8. Ausg.)Stein, Stefan. Laser Drop on Demand Joining as Bonding Method for Electronics Assembly and Packaging with High Thermal Requirements. FAU University Press, 2022.
Achtung: Diese Zitate sind unter Umständen nicht zu 100% korrekt.