rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
  title info:
    title: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference
  name:
    name part: Institute of Electrical and Electronics Engineers
    role:
      role term: creator
    role:
      role term: author,
    role:
      role term: issuing body.
  type of resource: text
  genre: conference publication
  origin info:
    place:
      place term: nju
    date issued: 2022
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: remote
    extent: 1 online resource : illustrations
  table of contents: Agenda -- Plenary Speech -- Welcome Message from Chih-I Wu, Conference General Chair -- Committee Member -- Index -- Copyright -- IMPACT 2022 Cover Page -- Copyright Page -- Title Page -- Root Cause of Analysis on the FCCL Delamination of Rigid Flexible Board -- Research on the Thermal Cycle Test Performance Improving in Automotive R-F PCB -- High Temperature Resistant Protection Tape For Panel Level Embedded Chip Package On Substrate.
  note: Institute of Electrical and Electronics Engineers.
  subject:
    topic: Microelectromechanical systems
    genre: Congresses
  classification: TK7875 .I578 2022
  classification: 621.381
  identifier: 9781665452212
  identifier: 1665452218
  record info:
    record content source: NjHacI
    record creation date: 240605
    record change date: 20241212213922.0
    record identifier: 99371849785906441
    language of cataloging:
      language term: eng