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2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference
Institute of Electrical and Electronics Engineers
Agenda -- Plenary Speech -- Welcome Message from Chih-I Wu, Conference General Chair -- Committee Member -- Index -- Copyright -- IMPACT 2022 Cover Page -- Copyright Page -- Title Page -- Root Cause of Analysis on the FCCL Delamination of Rigid Flexible Board -- Research on the Thermal Cycle Test Performance Improving in Automotive R-F PCB -- High Temperature Resistant Protection Tape For Panel Level Embedded Chip Package On Substrate.